FLIR A50/A70 Research & Development Kits

$7,599.00$9,779.00

FLIR A50 A70 Research & Development Kits are affordable, ready-to-use solutions for thermal imaging analysis in proof-of-concept electronics testing and R&D applications.

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Description

FLIR A50 A70 Research & Development Kits are affordable, ready-to-use solutions for thermal imaging analysis in proof-of-concept electronics testing and R&D applications.

Providing thousands of temperature measurement points, users can eliminate thermal guesswork, reduce product development time, and increase product efficiency and reliability. These kits are the right choice for engineers and technicians who need to fully understand the thermal profiles of their systems or require defensible thermal data to support critical decisions.

Users can quickly view, record, analyze and share thermal data with the included FLIR Research Studio software or take advantage of industry-standard connections to integrate into custom software applications when needed.

Affordable, ready-to-use solution for thermal imaging analysis and R&D.

Improve Efficiency

Quickly reveal thermal characteristics to eliminate guesswork and reduce product development time

  • Accurately measure temperatures with up to 307,200 thermal measurement pixels (640 × 480 resolution) and ±2°C accuracy
  • Reveal unknown thermal anomalies faster with quality infrared imagery
  • Easily differentiate between features and components with the built-in visible camera
  • Enhance understanding of infrared image data using FLIR MSX®

Capture Meaningful Data Quickly

Start testing sooner with limited ramp-up time and simple non-proprietary industry standard interfaces

  • Stream full radiometric image data using standard Gigabit Ethernet or Wi-Fi connections
  • Perform qualitative and quantitative thermal analysis with the included FLIR Research Studio software
  • Quickly view, record, analyze and share important thermal data across multiple platforms and languages
  • Compare and examine thermal data simultaneously from multiple connected cameras and recorded data files

Rugged, Compact, and Flexible

Meet the demands of multiple application environments and installations

  • Ensure operation in tough environments thanks to rugged M-style connectors and standard IP66 protection
  • Easily install this compact camera in any location, with multiple mounting options
  • Eliminate the need for multiple cables using Power over Ethernet and included Wi-Fi connectivity
  • Transition from design and testing in the lab to process control in production using non-proprietary GigE Vision and GenICam protocols, as well as SDKs

Specifications

Detector Data A50 R&D Kit A70 R&D Kit
IR resolution 464 × 348 640 × 480
Thermal resolution/NETD A50: 29°: <35 mK, 51°: <35 mK, 95°: <45 mK A70: 29°: <45 mK, 51°: <45 mK, 95°: <60 mK
Focal Plane Array Uncooled Microbolometer
Detector Pitch 17 μm 12 μm
Spectral Range 7.5–14.0 µm
Frame Rate 30 Hz
Image and Optical Data
Camera f/# 1.4
Lens Field of View Options 29°, 51°, 95°
Spatial Resolution (IFOV) 29°: 1.2 mrad/pixel
51°: 2.1 mrad/pixel
95°: 4.0 mrad/pixel
29°: 0.84 mrad/pixel
51°: 1.5 mrad/pixel
95°: 2.9 mrad/pixel
Lens Type Fixed, cannot be changed
Focus Adjustable with included focus tool
Minimum Focus Distance 29°: 0.25 m / 51°: 0.2 m / 95°: 0.1 m
Visual Camera Included
Visual Resolution 1280 × 960
Measurement
Object temperature range A50:
-20°C to 175°C (-4°F to 347°F)
175°C to 1000°C (347°F to 1832°F)
A70:
-20°C to 175°C (-4°F to 347°F)
-20°C to 250°C (-4°F to 482°F)
175°C to 1000°C (347°F to 1832°F)
Accuracy ±2°C (±3.6°F) or ±2% of reading, for ambient temperature 15°C to 35°C (59°F to 95°F) and object temperature above 0°C (32°F)
Image Presentation
Digital Data Via workstation running included Research Studio Software
Digital Data Streaming Gigabit Ethernet (RTSP, GigE Vision), Wi-Fi
Command & Control Gigabit Ethernet (RTSP, GigE Vision), Wi-Fi
Dynamic Range 16-bit
Image Modes in Research Studio
Infrared Radiometric
Visual Non-radiometric
Screen Non-radiometric, selected in software (Thermal, MSX®, Visual, FSX)
Wi-Fi
Connector Type Female RP-SMA
Standard IEEE802.11a/b/g/n
Connections Peer to peer (ad hoc) or Infrastructure (network)
Gigabit Ethernet
Ethernet Image Streaming Yes
Ethernet Connector Type M12 8-pin X-coded, female
Ethernet Interface Wired, Wi-Fi
Ethernet Power Power over Ethernet, PoE IEEE 802.3af class 3.
Ethernet Type 1000 Mbps
Digital Input/Output
Connector Type M12 Male 12-pin A-coded (shared with external power)
Digital I/O Isolation Voltage 500 VRMS
Digital Input 2× opto-isolated, Vin (low) = 0 to 1.5 V, Vin (high) = 3 to 25 V
Digital Output 3× opto-isolated, 0 to 48 V DC, max. 350 mA (derated to 200 mA at 60°C). Solid-state opto relay, 1× dedicated as fault output (NC)
Power
Configuration Power over Ethernet or External
Connector Type M12 Male 12-pin A-coded (shared with Digital I/O)
External Power Operation 24/48 V DC, 8 W max
Power Consumption 7.5 W at 24 V DC typical; 7.8 W at 48 V DC typical
Physical data
Size (L × W × H) 107 × 67 × 57 mm, without bottom cooling plate
Housing Material Aluminum
Tripod Mounting 1/4-20 UNC depth 7 mm + Ø5 depth 2.7 mm
Atmospheric Transmission Correction Based on inputs of distance, atmospheric temperature, and relative humidity
Corrosion ISO 12944 C4 G or H; EN60068-2-11
Encapsulation IEC 60529, IP66
Humidity (Operating and Storage) IEC 60068-2-30/24 hours, 95% relative humidity, 25°C to 40°C (77°F to 104°F)/ 2 cycles EN60068-2-38
Operating Temperature Range –20°C to 50°C (–4°F to 113°F), with included cooling plate. Maximum camera case temperature: 65°C (149°F)
Wi-Fi Radio Spectrum FCC 47 CFR Part 15 Class C (2.4 GHz band US); FCC 47 CFR Part 15 Class E (5 GHz band US); RSS-247 (2.4 GHz and 5 GHz band Canada); ETSI EN 300 328 V2.1.1 (2.4 GHz band EU); ETSI EN 301 893 V2.1.1 (5 GHz band EU)
Shock IEC 60068-2-27, 25 g
Vibration IEC 60068-2-6, 0.15 mm at 10 Hz to 58 Hz and 2 g at 58 Hz to 500 Hz, Sinusoidal IEC 61373 Cat 1 (Railway)

Documentation

FLIR A50/A70 R&D Kits Datasheet

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