Optris PI 640i 8μm Microscopy System
$16,950.00
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Microscope optics for chip-level thermal imaging of electronic components and boards
The newly developed Microscope lenses are especially designed for thermal inspection of electronic boards and analyses of small chip level components down to 8 μm. The distance between the measurement object and the camera is 15 mm (MO2X) [0.59 in].
Important specifications:
- Analysis of small chip level components down to 8 μm
- Exchangeable, focusable optics for most flexible use of the camera
- Microscope stand included for hands-free simultaneous operation / testing
- Exchangeable, focusable lenses for most flexible use of the camera
- With a Temperature resolution (NETD) of 80 mK
- Frame rates up to 125 Hz allow inspection of fast processes (like pulsed laser diodes)
- Radiometric video or tiff recording with +/-2 °C measurement accuracy
- License-free analysis software and complete SDK included
Lens: MO2X: f=60 mm (2.36 in)/ 5.4 (0.21 in) x 4.0 mm (0.16 in)(F=1.3)/ Min. spot (IFOV): 8 μm
Temperature range: -20-100 °C/ 0-250 °C/ (20)150-900 °C (–4 … 212 °F, 32 … 482 °F, (4) 302 … 1652 °F1)
Please note: This item has an average lead time of 4-6 weeks for delivery.
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Description
The newly developed Microscope lenses are especially designed for thermal inspection of electronic boards and analyses of small chip level components down to 8 μm. The distance between the measurement object and the camera is 15 mm (MO2X) [0.59 in].
Important specifications:
- Analysis of small chip level components down to 8 μm
- Exchangeable, focusable optics for most flexible use of the camera
- Microscope stand included for hands-free simultaneous operation / testing
- Exchangeable, focusable lenses for most flexible use of the camera
- With a Temperature resolution (NETD) of 80 mK
- Frame rates up to 125 Hz allow inspection of fast processes (like pulsed laser diodes)
- Radiometric video or tiff recording with +/-2 °C measurement accuracy
- License-free analysis software and complete SDK included
Lens: MO2X: f=60 mm (2.36 in)/ 5.4 (0.21 in) x 4.0 mm (0.16 in)(F=1.3)/ Min. spot (IFOV): 8 μm
Temperature range: -20-100 °C/ 0-250 °C/ (20)150-900 °C (–4 … 212 °F, 32 … 482 °F, (4) 302 … 1652 °F1)
Fields of applications for the IR microscope lenses
The optris Microscope optics are ideally suited to thermally analyze both entire circuit boards and detailed macro shots of individual components can be measured reliably. The high-quality thermal and geometric detail resolution of the infrared cameras allows for an effective and precise functional testing of electronic products.
With the new MO2X microscope optics with 2x magnification, the PI 640i infrared camera from Optris is now able to capture infrared images of even complex structures. For an exact temperature measurement, 4×4 pixels are required (MFOV), so that objects with a size of only 34 µm (MO44) can now be measured. This means that even tiny structures can be analyzed at chip level. The thermal resolution of 80 mK is a very good value for this optic. The focus of the new optics makes it possible to work at a distance of 15 mm from the object being measured. As the optics on the PI series infrared cameras can be easily exchanged, the system can be used flexibly for various measurement tasks. Together with the supplied high-quality microscope stand with fine adjustment, microelectronic assemblies can be inspected very easily.
Specifications
| Technical Specifications – Optris PI 640i Microscope Kit | |
|---|---|
| Minimum spot size | 8 μm |
| Microscope optics (FOV) | 5.4 x 4.0 mm (F=1.3)/ f=60 mm |
| Working distance | 15 mm |
| Temperature range (scalable) | –20 … 100 °C, 0 … 250 °C, 150 … 900 °C (–4 … 212 °F, 32 … 482 °F, (4) 302 … 932 °F) |
| Detector | FPA, 640 x 480 pixels @ 32 Hz 640 x 120 pixels @ 125 Hz |
| Spectral range | 8 – 14 μm |
| System accuracy (at ambient temperature 23 ± 5°C) | ±2 °C or ±2 %, whichever is greater (±3.6 °F or ±2 %, whichever is greater) |
| Temperature resolution (NETD) | 80 mK |
| PC interface | USB 2.0 |
| Standard process interface (PIF) | 0–10 V input, digital input (max. 24 V), 0–10 V output |
| Industrial process interface (IPF) | 2x 0–10 V input, digital input (max. 24 V), 3x 0–10 V output, 3x relay (0–30 V / 400 mA), fail safe relay |
| Cable length (USB) | 1 m (standard), 3 m, 5 m, 10 m, 20 m (3.3 ft [standard], 9.8 ft, 16.4 ft, 32.8 ft, 65.6 ft) |
| Ambient temperature | 0 … 50 °C (32 … 122 °F) |
| Storage temperature | –40 … 70 °C (-40 … 158 °F) |
| Relative humidity | 10 – 95 %, non-condensing |
| Enclosure (size / rating) | 52 x 59 x 139 mm / IP 67 (NEMA 4) |
| Weight | 410 g (14.46 oz) |
| Shock/Vibration | IEC 60068-2-27 (25G and 50G) / IEC 60068-2-6 (sinus shaped), IEC 60068-2-64 (broadband noise) |
| Tripod mount | 1/4 – 20 UNC |
| Power supply | via USB |
| Emissivity | 0.100…1.100 |
| Software | Optris PIX Connect / Windows and Linux SDKs |
