Optris PI 640i 8μm Microscopy System

$16,950.00

The newly developed Microscope lenses are especially designed for thermal inspection of electronic boards and analyses of small chip level components down to 8 μm. The distance between the measurement object and the camera is 15 mm (MO2X) [0.59 in].

Availability 4 to 6 Weeks

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Description

The newly developed Microscope lenses are especially designed for thermal inspection of electronic boards and analyses of small chip level components down to 8 μm. The distance between the measurement object and the camera is 15 mm (MO2X) [0.59 in].

Important specifications:

  • Analysis of small chip level components down to 8 μm
  • Exchangeable, focusable optics for most flexible use of the camera
  • Microscope stand included for hands-free simultaneous operation / testing
  • Exchangeable, focusable lenses for most flexible use of the camera
  • With a Temperature resolution (NETD) of 80 mK
  • Frame rates up to 125 Hz allow inspection of fast processes (like pulsed laser diodes)
  • Radiometric video or tiff recording with +/-2 °C measurement accuracy
  • License-free analysis software and complete SDK included

Lens: MO2X: f=60 mm (2.36 in)/ 5.4 (0.21 in) x 4.0 mm (0.16 in)(F=1.3)/ Min. spot (IFOV): 8 μm

Temperature range: -20-100 °C/ 0-250 °C/ (20)150-900 °C (–4 … 212 °F, 32 … 482 °F, (4) 302 … 1652 °F1)

Fields of applications for the IR microscope lenses

The optris Microscope optics are ideally suited to thermally analyze both entire circuit boards and detailed macro shots of individual components can be measured reliably. The high-quality thermal and geometric detail resolution of the infrared cameras allows for an effective and precise functional testing of electronic products.

With the new MO2X microscope optics with 2x magnification, the PI 640i infrared camera from Optris is now able to capture infrared images of even complex structures. For an exact temperature measurement, 4×4 pixels are required (MFOV), so that objects with a size of only 34 µm (MO44) can now be measured. This means that even tiny structures can be analyzed at chip level. The thermal resolution of 80 mK is a very good value for this optic. The focus of the new optics makes it possible to work at a distance of 15 mm from the object being measured. As the optics on the PI series infrared cameras can be easily exchanged, the system can be used flexibly for various measurement tasks. Together with the supplied high-quality microscope stand with fine adjustment, microelectronic assemblies can be inspected very easily.

Specifications

Technical Specifications – Optris PI 640i Microscope Kit
Minimum spot size 8 μm
Microscope optics (FOV) 5.4 x 4.0 mm (F=1.3)/ f=60 mm
Working distance 15 mm
Temperature range (scalable) –20 … 100 °C, 0 … 250 °C, 150 … 900 °C
(–4 … 212 °F, 32 … 482 °F, (4) 302 … 932 °F)
Detector FPA, 640 x 480 pixels @ 32 Hz
640 x 120 pixels @ 125 Hz
Spectral range 8 – 14 μm
System accuracy (at ambient temperature 23 ± 5°C) ±2 °C or ±2 %, whichever is greater
(±3.6 °F or ±2 %, whichever is greater)
Temperature resolution (NETD) 80 mK
PC interface USB 2.0
Standard process interface (PIF) 0–10 V input, digital input (max. 24 V), 0–10 V output
Industrial process interface (IPF) 2x 0–10 V input, digital input (max. 24 V),
3x 0–10 V output, 3x relay (0–30 V / 400 mA), fail safe relay
Cable length (USB) 1 m (standard), 3 m, 5 m, 10 m, 20 m
(3.3 ft [standard], 9.8 ft, 16.4 ft, 32.8 ft, 65.6 ft)
Ambient temperature 0 … 50 °C (32 … 122 °F)
Storage temperature –40 … 70 °C (-40 … 158 °F)
Relative humidity 10 – 95 %, non-condensing
Enclosure (size / rating) 52 x 59 x 139 mm / IP 67 (NEMA 4)
Weight 410 g (14.46 oz)
Shock/Vibration IEC 60068-2-27 (25G and 50G) / IEC 60068-2-6 (sinus shaped), IEC 60068-2-64 (broadband noise)
Tripod mount 1/4 – 20 UNC
Power supply via USB
Emissivity 0.100…1.100
Software Optris PIX Connect / Windows and Linux SDKs

Documentation

Optris PI 640i Microscope Kit Datasheet

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