FLIR X8580 MWIR + Complete Active Thermography System

This product is currently out of stock and unavailable.

This product is currently out of stock and unavailable.

MoviTHERM’s FLIR X8580 MWIR non‐destructive testing systems use active thermography for the reliable detection of delaminations, impact damages, “near side” defects, water inclusions, debondings, and other defects. The system achieves precise measurements and is ideal for inspecting composites, metals, semiconductors, microelectronics, batteries, ceramics, and more.

Our irNDT system accommodates a wide range of irNDT measurement methods, including: Flash‐Thermography, Lock‐In Thermography, Transient Thermography, and Vibro‐Thermography. It also works with multiple excitation sources and with cooled or uncooled infrared camera systems.

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Description

About the FLIR X8580 MWIR Camera

The FLIR X8580 midwave IR camera is designed for scientists and engineers who need to capture detailed imagery of high-speed events, perform custom radiometric measurements, or detect points of failure in composites, solar cells, and electronics. This thermal imaging camera combines 1280 × 1024 HD resolution with fast frame rates and integration times, allowing researchers to record stop motion on fast-moving subjects or rapid temperature changes—whether in the lab or on the test range. The X8580 will provide higher quality recordings, save time, and mitigate frustration in dynamic acquisition environments with a four-position motorized filter wheel and support for FLIR motorized focus lenses.

  • Full Frame Rate Streaming: Experience unmatched image clarity and speed with 10 GigE, CXP 2.1 high-speed interfaces or Camera Link Full.
  • Extended SSD Recording: Capture more than two hours of detailed thermal events directly to a 4 TB SSD with zero dropped frames.
  • Precise Timing System: Proprietary triggering, synchronization, and accurate IRIG time stamping system ensures precise on-time recording.

About the Active Thermography System

MoviTHERM’s FLIR X8580 MWIR non‐destructive testing systems use active thermography for the reliable detection of delaminations, impact damages, “near side” defects, water inclusions, debondings, and other defects. The system achieves precise measurements and is ideal for inspecting composites, metals, semiconductors, microelectronics, batteries, ceramics, and more.

Our irNDT system accommodates a wide range of irNDT measurement methods, including: Flash‐Thermography, Lock‐In Thermography, Transient Thermography, and Vibro‐Thermography. It also works with multiple excitation sources and with cooled or uncooled infrared camera systems.

Features:

  • Non‐contact irNDT
  • Works with cooled and uncooled IR Cameras
  • Compatible with multiple irNDT methods
  • Effective even on low emissivity targets
  • Modular hardware and software
  • Configurable for different geometries and materials

What is Active Thermography?

Active thermography is an effective method for non-destructive testing of materials involving the induction of heat flow in a test object by external excitation. The heat flow within the test object is influenced by internal conditions and measured on the surface by an IR camera. This technique detects not only the smallest surface defects, but also internal structural defects under the surface.

Active vs Passive Thermography

Active and passive thermography are techniques used for detecting heat patterns and abnormalities in various applications. While passive thermography relies on naturally occurring temperature changes, active thermography introduces an external energy source to create thermal contrast.

How does the system work?

MoviTHERM’s modular irNDT system works by utilizing active thermography. A heat source provides the inspected material with a thermal excitation. The flow of thermal energy through the material has a direct effect on surface temperatures. The surface temperature is recorded over a certain time period with an infrared camera and analyzed by the irNDT software.

The software produces an image that provides information about the internal structure of the material.

  • Non-Contact Defect Detection: Active thermography reveals the most subtle defects that are visibly undetectable.
  • Flexible & Expandable: Upgrade a system by adding excitation sources, irNDT methods, and higher end IR cameras.
  • irNDT Made Easy: Complex analysis technology is simplified for dependable inspection results.

 

The Software Interface

Specifications

Camera Specifications

X8580HS X8581HS X8582HS X8583HS
Part # 29760-280 29760-281 29760-282 29760-283
Detector Type FLIR Indium Antimonide (InSb)
Spectral Range 1.5 – 5.0 μm 3.0 – 5.0 μm 1.5 – 5.0 μm 3.0 – 5.0 μm
Camera f/# f/2.5 f/2.5 f/4.1 f/4.1
Resolution 1280 × 1024
Detector Pitch 12 μm
Thermal Sensitivity/NETD, typical 30 mK typical
Operability ≥99.5% (≥99.9% typical)
Sensor Cooling Linear Sterling Cooler
Readout Type Snapshot
Readout Modes Asynchronous Integrate While Read; Asynchronous Integrate Then Read
Synchronization Modes Sync In, Sync Out, Tri-Level Sync, Video Sync
Image Time Stamp Internal precision timestamp. IRIG-B AM decoder, TSPI accurate, Free wheel if sync signal is lost
Trigger Modes Trigger In, Software generated, Time generated
Integration Time 270 ns to ~Full Frame
Pixel Clock 355.2 MHz
Frame Rate (Full Window) Programmable; approx. 0.5 Hz to 181 Hz
Subwindow Mode Flexible windowing down to 64 × 4 (steps of 64 columns, 2 rows)
Dynamic Range 14-bit
Radiometry Yes
Stress mapping Yes
Direct to SSD Recording Yes, removable 4 TB NVMe SSD included, approx. 2 hours of zero dropped frames record time
On-Camera Image Storage RAM (volatile): 64 GB, up to 23,000 frames full frame
NVMe U.2 SSD (user-removable/non-volatile): 4 TB U.2 SSD included, up to 1.4 M frames full frame
Download of on-camera RAM/SSD recordings Transfer from SSD through 10 GigE, CXP, or CL to Research Studio
Radiometric Data Streaming Simultaneous 10 Gigabit Ethernet (GigE Vision), Camera Link Full, CoaXPress (CXP 2.1) Single link @ 10 Gbps or Dual Link @ 5 Gbps
Standard Video HDMI, SDI
Command and Control GigE, USB, RS-232, Camera Link, CXP (GenICam protocol supported over GigE or CXP)
Standard Temperature Range (with band matched optics) -20°C to 300°C (-4°F to 572°F) -20°C to 350°C (-4°F to 662°F), -10°C for microscopes -20°C to 350°C (-4°F to 662°F) -20°C to 350°C (-4°F to 662°F), -10°C for microscopes
Optional Temperature Range (with band matched optics) 45°C to 600°C (ND1)
250°C to 2000°C (ND2)
500°C to 3000°C (ND3)
Accuracy ≤ 100°C ±2°C (±1°C typical), > 100°C ±2% of reading (±1% typical)
Ambient Drift Compensation (with factory cal) Yes
Available Lenses Manual (broadband): 25 mm, 50 mm, 100 mm
Motorized (broadband): 25 mm, 50 mm, 100 mm
Manual (3.0 – 5.0 μm): 17 mm, 25 mm, 50 mm, 100 mm, 200 mm, Macro
Motorized (3.0 – 5.0 μm): 17 mm, 25 mm, 50 mm, 100 mm, 200 mm
Manual (broadband): 25 mm, 50 mm, 100 mm
Motorized (broadband): 25 mm, 50 mm, 100 mm
Manual (3.0 – 5.0 μm): 17 mm, 25 mm, 50 mm, 100 mm, 200 mm, 50mm Macro
Motorized (3.0 – 5.0 μm): 17 mm, 25 mm, 50 mm, 100 mm, 200 mm
Close-up Lenses/Microscopes No microscopes available 1x, 3x No microscopes available 1x, 3x, 5x, 1 × 20 cm LWD
Lens Interface FLIR FPO-M (4-tab bayonet, motorized)
Focus Motorized (compatible w/ manual)
Filtering 4-position motorized filter wheel, standard 1-inch filters, user swappable
Palettes Selectable 8-bit
Automatic Gain Control Manual, Linear, Plateau equalization, DDE
Overlay Customizable with the ability to toggle off
Video Modes HD-SDI: 720p@50/59.9 Hz, 1080p@25/29.9 Hz, 1080p@60 Hz
SD-SDI: 480i@60 Hz, 576i@50 Hz
Digital Zoom 1x, Auto (best fit)
Operating Temperature Range -20°C to 50°C (-4°F to 122°F)
Power 24 VDC (< 50 W steady state)
Weight w/o Lens 6.35 kg (14 lbs)
Size (L × W × H) w/o Lens 249 mm × 157 mm × 147 mm (9.8 in × 6.2 in × 5.8 in)
Mounting 2 × ¼ in. -20, 1 × 3/8 in. -16, 4 × #10 -24, Side: 3x ¼ in. -20 (each side)

Documentation

Active Thermography Brochure

FLIR X8580 MWIR Datasheet